LSI Logic Advances High Speed Serial Interconnect With New RapidChip(TM) Platform ASIC Family
- Time-to-market optimized PCI Express custom solutions at under $50 in volume
INTEL DEVELOPER FORUM, SAN FRANCISCO, Sept. 7 /PRNewswire-FirstCall/ -- LSI Logic Corporation (NYSE: LSI) today announced the advancement of affordable high-speed interconnect solutions (x1 through x4) for PCI Express developers with three new RapidChip IntegratorQS(TM) slices. The new slices leverage LSI Logic's proven-in-silicon and standards-compliant GigaBlaze(R) serializer/deserializer (SerDes) technology by including four independent lanes of 4.25 gigabits per second (Gbps) SerDes.
Another key architectural advantage of the RapidChip IntegratorQS slices is that they support PCI Express datapaths of 250 MHz. These datapaths are implemented in the metal configurable R-cell logic transistor fabric. The combination of SerDes and logic performance ensures that developers can implement ASIC-class low latency, high system performance solutions, with the benefits of risk mitigation and affordable NRE costs associated with Platform ASIC technology.
The RapidChip IntegratorQS Platform ASIC family provides faster time-to-market and a low-risk path for product developers who want to implement value added PCI Express peripherals and bridges in the communications, networking, computing and storage markets. The IntegratorQS slices range from 1 to 2.9 million usable gates, allowing developers to choose an optimal solution for their particular application.
"With momentum building behind serial interconnect standards and mainstream adoption of PCI Express, we believe the RapidChip IntegratorQS family of slices is ideally suited for applications in the 1x through 4x category," commented Arnaud Schleich, vice president of sales and marketing at PLDA, a leading IP developer focused on the needs of the PCI developer community. "At PLDA, we recognize the potential of technologies like LSI Logic's RapidChip Platform ASIC. By successfully porting our PCI-AHB and PCI-X cores to RapidChip, PLDA is enabling designers of RapidChip slices to take advantage of some of the industry's most popular PCI IP."
"By offering ASIC-class integration of our GigaBlaze(R) technology into the new pre-verified RapidChip IntegratorQS slices, our customers benefit from the industry's leading integrated SerDes, resulting in shorter time-to-market," said Mike Casey, director, RapidChip Strategic Marketing, LSI Logic. "Our five generations of integrated SerDes technology is proven in volume production and is compliant to multiple standards, including PCI Express, Gigabit Ethernet, 10 Gigabit Ethernet, Fibre Channel, SAS, SATA and InfiniBand, with narrower data paths and lower latency than is available on other solutions."
The IntegratorQS family continues to deliver features designers have come to expect from LSI Logic's RapidChip technology: slice to slice migration in compatible footprint packages for comprehensive support of low-risk design or feature creeps; IP on-demand, including Landing Zone(TM) support for ARM926EJ-S at up to 200 MHz and configurable DDR interfacing at up to 200 MHz point-to-point.
About RapidChip
The RapidChip Platform ASIC combines the high-density, high-performance benefits of cell-based ASICs with the fast time-to-market and customization benefits of FPGAs, and the proven IP benefits of ASSPs. Targeting the consumer, communications, storage and other markets, RapidChip Platform ASICs use LSI Logic's high-performance field-tested CoreWare(R) IP, customizable logic, embedded memory, and innovative design concepts to significantly reduce design and manufacturing risk and costs. RapidChip Platform ASICs also provide a fast and seamless migration path to full standard-cell ASIC -- driving unit costs even lower.
Unique to RapidChip Platform ASICs is the customer-friendly interface that dramatically simplifies the underlying complexity of the design tools and flows associated with SoC design. Rule sets automatically manage architectural design, verification, and physical design. As a result, design schedules for high- performance chips are very predictable. Information on RapidChip technology is available through LSI Logic's direct sales channels and worldwide distribution partners.
About LSI Logic Corporation
LSI Logic Corporation focuses on the design and production of high-performance semiconductors for Consumer, Communications and Storage applications that access, interconnect and store data, voice and video. LSI Logic engineers incorporate reusable, industry-standard intellectual property building blocks that serve as the heart of leading-edge systems. LSI Logic serves its global OEM, channel and distribution customers with Platform ASICs, standard-cell ASICs, standard products, host bus adapters, RAID controllers and software. In addition, the company supplies storage network solutions for the enterprise. LSI Logic is headquartered at 1621 Barber Lane, Milpitas, CA 95035. http://www.lsilogic.com/ .
Notes to Editor:
1. All LSI Logic news releases (financial, acquisitions, manufacturing,
products, technology etc.) are issued exclusively by PR Newswire and
are immediately thereafter posted on the company's external website,
http://www.lsilogic.com/ .
2. The LSI Logic logo design, RapidChip, RapidChip IntegratorQS, GigaBlaze
and CoreWare are trademarks or registered trademarks of LSI Logic
Corporation.
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CONTACT: Diana Hodges of LSI Logic Corporation, +1-408-433-4245, or
dhodges@lsil.com; or Linda Capcara of Brodeur Worldwide, +1-602-808-1166, or
lcapcara@brodeur.com, for LSI Logic Corporation
Web site: http://www.lsilogic.com/
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